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Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment

Foshan Jinxinsheng Vacuum Equipment Co., Ltd.
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    Buy cheap Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment from wholesalers
     
    Buy cheap Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment from wholesalers
    • Buy cheap Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment from wholesalers
    • Buy cheap Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment from wholesalers
    • Buy cheap Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment from wholesalers
    • Buy cheap Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment from wholesalers

    Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment

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    Price : As per configuration
    Brand Name : JXS
    Certification : CE
    Payment Terms : L/C, T/T
    Supply Ability : 100 sets/year
    Delivery Time : 70 working days
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    Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment

    Working Principle: Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is re-emission of the deposited material during the deposition process by ion or atom bombardment. Sputtered atoms ejected from the target have a wide energy distribution, typically up to tens of eV (100,000 K). The sputtered ions (typically only a small fraction of the ejected particles are ionized — on the order of 1 percent) can ballistically fly from the target in straight lines and impact energetically on the substrates or vacuum chamber (causing resputtering). Alternatively, at higher gas pressures, the ions collide with the gas atoms that act as a moderator and move diffusively, reaching the substrates or vacuum chamber wall and condensing after undergoing a random walk. The entire range from high-energy ballistic impact to low-energy thermalized motion is accessible by changing the background gas pressure. The sputtering gas is often an inert gas such as argon. For efficient momentum transfer, the atomic weight of the sputtering gas should be close to the atomic weight of the target, so for sputtering light elements neon is preferable, while for heavy elements krypton or xenon are used. Reactive gases can also be used to sputter compounds. The compound can be formed on the target surface, in-flight or on the substrate depending on the process parameters. The availability of many parameters that control sputter deposition make it a complex process, but also allow experts a large degree of control over the growth and microstructure of the film.

    Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment


    Feature: easy to control film thickness and color, fine and smooth film particle


    Application: 3C products, watch, jewelry, etc.


    Green process: no harmful gas, no waste water, no waste material.

    Quality Fine Uniform Thickness Film 3C Electronic Components Vacuum PVD Magnetron Sputtering Coating Equipment for sale
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